The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 1995
Filed:
Aug. 18, 1993
Jack Seidler, Flushing, NY (US);
North American Specialties Corporation, Flushing, NY (US);
Abstract
A solder-bearing lead adapted to be soldered to a conductive surface comprises an elongated body portion having a solder-bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mass either on a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass, or on one or both of the opposed faces of said solder-bearing portion. A region of the middle portion is twisted or the projections are bent so that the solder-bearing portion lies in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board, or as a surface-mounted lead for a substrate. The lead is arranged to provide, during soldering, direct metal-to-metal contact with the conductive area to which it is to be soldered, to avoid shifting of the parts due to molten solder.