The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 1995
Filed:
Sep. 02, 1993
Ronnie J Runyon, Kokomo, IN (US);
Delco Electronics Corp., Kokomo, IN (US);
Abstract
An interconnect device and method is provided for establishing communications between an electronic circuit board and a microprocessor emulator, so as to permit the evaluation or testing of an electronic circuit or system without a microprocessor flip chip or an integrated circuit socket being present on the circuit board. The flexible interconnect device serves to electrically connect the emulator to the individual conductors which compose a microprocessor flip chip conductor pattern formed on the electronic circuit board. The method involves a reflow soldering technique which bonds the flexible interconnect device to the microprocessor flip chip conductor pattern on the electronic circuit board, so as to form a reliable electrical connection between the flexible interconnect device and the circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile