High density, heat-dissipating circuit assembly with accessible

Abstract

A circuit assembly includes a platen for pressing carrier plates, bearing heat-dissipating components, against a heat sink. Circuits on one carrier plate are electrically connected with circuits on the other carrier plate by corresponding contacts on each carrier plate which the platen presses into mutual contact as it presses the carrier plates against the heat sink. The surfaces to which the carrier plates are pressed is stepped, which serves to align the carrier plates with respect to each other. One or more substrates, bearing other circuit elements, are attached to the platen and electrically connected to circuits on the carrier plate by resilient contact elements attached to the platen. The resilient contact elements press against contact surfaces of the carrier plates and substrates to make connections. Recesses in the platen also facilitate alignment of the carrier plates and components thereon. The interconnection of components by the resilient contact elements, and the locating effect of recesses in the heat sink and platen makes it possible to assemble and disassemble the circuit assembly rapidly and conveniently.