The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 1995
Filed:
Jun. 04, 1993
Glenn R Borchardt, Franklin Park, IL (US);
Roy T Swanson, La Grange Park, IL (US);
James W Barker, Jr, Niles, IL (US);
S&C Electric Company, Chicago, IL (US);
Abstract
An electrical path or interconnection arrangement is provided within a formed support body of polymeric material that exhibits volumetric changes during and after the forming thereof. The electrical path or interconnection arrangement provides an accurately positioned electrically conductive path through the material of the support body and also responds to, accommodates and alleviates the effects of forces at the interface between the material of the support body and the electrical path or interconnection arrangement that occur during and after the forming of the support body. The interconnection arrangement exhibits predetermined deformability/compressibility characteristics to alleviate stresses caused by the volumetric changes of the polymeric material. In a preferred arrangement, the interconnection arrangement includes an elongated tubular conductor fabricated from a metallic material. The material, the thickness of the tubular walls of the conductor, and the dimensions of the cross-section of the conductor are selected in accordance with the dimensions of the electrical path and the characteristics of the polymeric material to provide predetermined deformability/compressibility characteristics so as to avoid undesirable stress at the interface of the conductor and the polymeric material. In a specific embodiment, the interconnection arrangement also provides for the grading of the electrical field about a terminal conductor via the provision of a resilient member that is disposed about the terminal conductor and also connects one end of a conductor of the interconnection arrangement to the terminal conductor.