The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 1995
Filed:
Sep. 30, 1994
Hans L Melgaard, North Oaks, MN (US);
Louis A Larson, Golden Valley, MN (US);
Brian E Hajder, Crystal, MN (US);
Phillip G Jordon, Roseville, MN (US);
Eric W Nelson, St. Paul, MN (US);
Despatch Industries, Inc., Minneapolis, MN (US);
Abstract
The present invention, in one embodiment, provides a testing apparatus for electronic components to monitor their behavior at elevated temperatures. The invention comprises a transport belt with at least one carrier attached to the transport belt, the carrier being capable of retaining an electronic component. The carriers are adapted to contact bus bars positioned adjacent the transport belt to electrically connect a component retained by the carrier to an electrical power supply. The apparatus includes means for ramping up the electrical power applied to the component from an initial low voltage to a second, testing voltage. The apparatus includes a housing defining an oven cavity through which the transport belt may pass and means providing for maintaining the ambient temperature within a portion of the cavity at an elevated temperature and other embodiment, the carrier of the present invention comprises a slot for releasably retaining an electronic component and a retaining bar movable between the first component retaining position and a second, component releasing position, the retaining bar being capable of preventing electronic components from falling out of the slots when the carrier is inverted. In other embodiment, the present invention comprises a method for testing electronic components generally comprising the steps of operatively connecting an electronic component to an electrical power source, gradually increasing power from an initial low power level to a higher testing power level, placing the component in an elevated temperature environment, monitoring the behavior of the component at the elevated temperature while supplying electrical power to the component, and disconnecting the electronic component from the electrical power source.