The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 1995
Filed:
Feb. 05, 1993
Hironobu Ikeda, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A cooling structure for an integrated circuit that uses a liquid coolant to absorb heat directly from the integrated circuit includes a wiring substrate, an integrated circuit mounted on the wiring substrate, and a hollow cooling block, in which liquid coolant accumulates, disposed on a heat radiating surface of the integrated circuit. The upper portion of the cooling block is provided with an inlet port and an outlet port to allow the liquid coolant to enter and exit, respectively. A nozzle is mounted on the inlet port to jet the liquid coolant to the heat radiating surface. The lower portion of the cooling block consists of an opening portion which is opposed to the heat radiating surface, and which allows the liquid coolant to come in contact with and directly cool the heat radiating surface. The opening portion is liquid-tightly sealed to the heat radiating surface by a sealing member and/or a frame mounted on the heat radiating surface.