The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 1995
Filed:
Sep. 07, 1993
Applicant:
Inventor:
James V Hause, Phoenix, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437183 ; 437195 ; 437205 ; 437215 ; 437-8 ; 257723 ; 257786 ;
Abstract
A test card (10) or a semiconductor die (150) having bonding pads (41-43, 180-182) for testing semiconductor devices, and a method for making the bonding pads (41-43, 180-182) are shown. The test card (10) or the semiconductor die (150) is partitioned into a plurality of bonding pad regions (14-17 and 170-173). Bonding pads (41-43, 180-182) are formed in the respective bonding pad regions (14-17 and 170-173). The bonding pad regions (14-17 and 170-173) and the bonding pads (41-43, 180-182) are formed by patterning a layer of conductive material (16, 167) on a major surface (12) of the test card (10) or on the semiconductor die (150).