The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 1995

Filed:

Apr. 27, 1993
Applicant:
Inventors:

Masaya Imamura, Kyoto, JP;

Kensuke Sawase, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N / ;
U.S. Cl.
CPC ...
358471 ; 358496 ; 2502081 ;
Abstract

A small-sized image sensor which does not exert the deleterious influence of soldering, especially, on the light receiving device when attaching a substrate for a light emitting device. A glass cover (11) is attached to the upper portion of a frame (10), and a substrate of a light projecting portion having a light emitting device (12) is fixed to the frame (10) in such a manner as to be inclined toward the glass cover (11). A rod lens array (14) for converging the light reflected from a copy on the glass cover (11) is fixed to the frame (10) in such a manner as to be perpendicular to the glass cover (11). A sensor substrate (16) having a light receiving device (15) is disposed directly under the rod lens array (14), and a hybrid substrate (21) with an electronic part (20) mounted thereon is disposed in a space within the frame (10). The substrates (16) and (21) are connected by a lead frame (22 ) soldered to the bottom surface of the sensor substrate (16). The lead frame also supports the substrate (21).


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