The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 1995

Filed:

Apr. 22, 1992
Applicant:
Inventors:

Kazumichi Yamamoto, Hachioji, JP;

Keiichirou Nakanishi, Tokyo, JP;

Moritoshi Yasunaga, Pittsburgh, PA (US);

Tatsuya Saitoh, Kokubunji, JP;

Katsunari Shibata, Kokubunji, JP;

Minoru Yamada, Hanno, JP;

Noboru Masuda, Kokubunji, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257777 ; 257778 ; 327565 ;
Abstract

A semiconductor integrated circuit device includes a plurality of integrated circuit chips and a large-sized integrated circuit element on which the plurality of integrated circuit chips are mounted. The large-sized integrated circuit element includes a logic circuit for electrically interconnecting the integrated circuit chips mounted on it. The logic circuit provided within the large-sized integrated circuit element includes a control circuit for controlling a connection relation between the integrated circuit chips mounted on the large-sized integrated circuit element. Further, the logic circuit includes buffer or latch circuits for relaying signals transmitted between the integrated circuit chips.


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