The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 1995
Filed:
Oct. 13, 1993
Isamu Morisako, Fukuoka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A wire bonding apparatus has a sealed casing having an opening which can be opened and closed, a device for gas-tightly dividing the casing into first and second chambers, a sealing device that is movable for communicating the two chambers with each other, a device for supplying an inert gas into the first chamber, a device for supplying oxygen gas or ozone gas into the second chamber, a device for connecting an electrode of the substrate to an electrode of the semiconductor chip via the wire in the first chamber, a device for generating glow discharge in the second chamber, and a device for transporting the substrate between the first and second chambers. Wire bonding is immediately performed after impurities are removed from the electrodes by electrical discharge.