The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 1995

Filed:

Sep. 23, 1994
Applicant:
Inventors:

Chan U Ko, Woodbury, MN (US);

Steven C Hackett, St. Paul, MN (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ; D04H / ; D04H / ;
U.S. Cl.
CPC ...
4285428 ; 264135 ; 264137 ; 264258 ; 264324 ; 26433112 ; 428 74 ; 428114 ; 428224 ; 428236 ; 428237 ; 428239 ; 428240 ; 428245 ; 428246 ; 428260 ; 428261 ; 428262 ; 428268 ; 428281 ; 428282 ; 428283 ; 428284 ; 428286 ; 428290 ; 428327 ; 428339 ; 428413 ;
Abstract

The invention relates to a resin transfer molding preform binder resin that comprises at least one aromatic polyepoxide, a fluorene epoxide that is different than the aromatic polyepoxide and having a defined structure, and a 9,9-bis(aminophenyl)fluorene curing agent. The binder resin is a solid, room temperature stable, essentially nonsintering powder that displays a glass transition temperature greater than about 40.degree. C. Also disclosed are preforms made with the binder resin and a method for preparing the preforms.


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