The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 1995

Filed:

Nov. 17, 1993
Applicant:
Inventors:

Hiroaki Suzuki, Kawasaki, JP;

Akio Sugama, Kawasaki, JP;

Naomi Kojima, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N / ;
U.S. Cl.
CPC ...
204415 ; 204426 ; 204431 ; 204433 ; 204403 ; 204412 ; 204418 ; 204408 ; 435817 ; 435288 ;
Abstract

A small oxygen electrode and a method of bonding a fluorine resin film are disclosed. This small oxygen electrode includes a flat electrode substrate having at least two electrodes (a working electrode and a counter electrode) formed thereon, and a container substrate having dents formed to confront the two electrodes and contain an electrolyte therein. The container substrate is bonded to the flat electrode substrate, so that the dent confronting the electrode constituting the working electrode has a through hole extending to the side opposite to the flat electrode substrate and a gas-permeable film is formed to cover the through hole. By using this dent structure, the preparation of an oxygen electrode can be conducted while maintaining a wafer form throughout the process, and formation of an electrode pattern can be facilitated. The method of bonding the fluorine resin film includes treating the fluorine resin film with an agent containing metallic sodium, then treating the fluorine resin film with a silane coupling agent. The treated fluorine resin film is fusion bonded by heating, and if necessary, conducting subsequent treatments in vacuo. By adopting this method, the fluorine resin film can be bonded tightly to the substrate and peeling of the fluorine resin film from the substrate can be prevented.


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