The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 1995
Filed:
Mar. 02, 1993
NGK Insulators, Ltd., , JP;
Abstract
A mold composed of bonded water-insoluble particles and having a molding layer and a support layer. The molding layer includes first water insoluble particles, having an average size of 0.2-1.0 mm bonded to form a layer having a thickness 1-20 times the average size of the first particles. The support layer positioned on the inner surface of the molding layer, on which the fiber bodies are not formed, includes of second water-insoluble particles, having an average size of 1.0-10.0 mm, bonded to form a layer having a thickness of at least the average size of the second particles. The pulp mold has advantages in that it hardly suffers from clogging, it produces fiber bodies each having a smooth surface, it is free from damage caused by repeated use, and it produces fiber bodies in a short period of time.