The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 1995

Filed:

Jul. 05, 1994
Applicant:
Inventors:

James H Lombard, Albuquerque, NM (US);

Rong F Huang, Albuquerque, NM (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
106-114 ; 106-119 ; 252514 ;
Abstract

A high adhesion strength, co-fireable, solderable silver metallization material for use with low-fire ceramics is provided. The metallization material includes the metallization powder as well as a binder vehicle, and an adhesion promoting agent. The combination of elements allows a metallization material which can be cofired at relatively low temperatures necessary for firing ceramic substrate materials while providing an adequate base for soldering subsequent circuit components to the ceramic substrate.


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