The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 1995
Filed:
May. 17, 1994
Applicant:
Inventors:
Miki Hasegawa, Kyoto, JP;
Chojiro Kuriyama, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
2281805 ; 228902 ;
Abstract
A method is provided for forming a ball at a lower end of a material solder wire which is arranged generally vertically. The method comprises the steps of: forming an upward stream of an oxygen-free gas surrounding the solder wire; bringing a lateral flame of combustion to a ball forming position adjacent to the upward gas stream but short of the solder wire to thermally melt the lower end of the solder wire into a ball; and causing the lower ball end of the solder wire to solidify in the upward gas stream.