The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 1995

Filed:

Oct. 19, 1992
Applicant:
Inventor:

Meng-Ling Hsiao, Schenectady, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F / ; G06F / ;
U.S. Cl.
CPC ...
395800 ; 364229 ; 3642319 ; 36493101 ; 3649314 ; 36494061 ; 36494064 ; 364D / ;
Abstract

According to the present invention, a 3D connectivity-conserved grain-structured processing architecture uses connectable massively parallel processors. A 3D grain-structured processing architecture is provided. The 3D links of the grain-structured processing architecture provide direct local communication as well as global communication for voxel processing and analysis tasks. A novel transport naming scheme which is scalable in any three-dimension direction and the local/global communication protocol are disclosed. The 3D volumetric data set is first divided into a set of voxel sub-cubes. Each voxel subcube is processed by a processor element of the grain-structured processing architecture. Data discontinuity is produced after performing local operations in a massively parallel processors environment and requires replacing the resulted voxel data set in the overlap region for each voxel sub-cube. An inter-processor communication procedure for overcoming this problem in the 3D connected grain-structured processors architecture is also disclosed.


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