The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 1995
Filed:
Jul. 06, 1993
Applicant:
Inventors:
Chandrakant Patel, Fremont, CA (US);
Hannsjorg Obermaier, Los Gotos, CA (US);
Assignee:
Hewlett-Packard Company, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361705 ; 257724 ; 361697 ; 361719 ;
Abstract
A spring-biased heat sink assembly for a multi-chip module that has several integrated circuit chips on a substrate. Thermal paste provides a thermal connection between a heat sink and the chips. A beam spring applies pressure to the back side of the substrate, maintaining a constant force that urges the chips against the heat sink and avoids mechanical stress that would otherwise result from lateral motion of the chips such as from differential expansion. A flat flexible cable connects the module with other circuitry.