The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 1995
Filed:
Jun. 22, 1993
Applicant:
Inventors:
Hideki Sawada, Kyoto, JP;
Hiromi Ogata, Kyoto, JP;
Assignee:
Rohm Co. Ltd., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257618 ; 257620 ; 257797 ; 437226 ; 437227 ;
Abstract
A plurality of semiconductor chips are formed on a wafer. By forming a dummy pattern of a linear shape on an insulating film formed on a semiconductor chip along dicing lines provided for separating the plurality of semiconductor chips into the individual semiconductor chips, when the separation of the semiconductor chips is performed along the dicing lines, an advancing of a film peeling to a recognition mark for bonding within the dummy pattern or elements is prevented to reduce both a recognition error of information at the time of bonding of the semiconductor chip and the number of defective elements.