The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 1995
Filed:
Dec. 10, 1993
Applicant:
Inventors:
Hai-jeong Sohn, Suwon, KR;
Young-hee Song, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Kyungki-do, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257676 ; 257668 ; 257664 ; 257666 ; 257691 ;
Abstract
Disclosed is a semiconductor device wherein the down bonding and the mounting of multi-pin is made possible. A conductive member adhered to the bottom surface of the semiconductor element. The conductive member and the specific pad of the semiconductor element are connected by the connecting member, which enables the entire bottom surface of the semiconductor element to be used for down bonding. Further, the more effective latch-up suppression, noise dispersion and speed improvement compared with the conventional LOC-type package structure is possible.