The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 1995
Filed:
Mar. 01, 1993
Applicant:
Inventor:
Johan O Hilbrink, Cincinnati, OH (US);
Assignee:
AT&T Global Information Solutions, Dayton, OH (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437214 ; 437214 ; 437220 ; 437902 ;
Abstract
A cooling package for a semiconductor chip includes, in addition to the chip, leads for the chip provided by a tape automated bonding frame, a cold header attached to the chip, a header frame, a pitch translator printed circuit board having conductive pads for receiving the chip leads and a plurality of holes connected to the pads, a plurality of attachment devices such as hollow thin wall stainless steel pins positioned in the holes, and a cavity insulator. The method of chip package assembly requires the assembly of two sub-assemblies and the subsequent assembly of the two sub-assemblies into a chip package.