The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 1995
Filed:
Jan. 24, 1994
Applicant:
Inventors:
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437217 ; 437209 ; 437211 ; 437214 ; 437219 ;
Abstract
A method of manufacturing a resin-sealed semiconductor device includes the steps of: supporting and fixing a supporting plate in a set of molds using a positioning pin with a sharp pin point which is inserted into the molds to have a predetermined clearance from the supporting plate; injecting a sealing resin 11 into a cavity formed in the molds; and removing the positioning pin from the molds after the sealing resin 11 hardens. This method increases the life of the positioning pin, facilitates the removal of a semiconductor device from the molds, and achieves a semiconductor device with good insulation.