The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 1995

Filed:

Dec. 13, 1993
Applicant:
Inventor:

Yoichi Hiruta, Matsudo, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361699 ; 361688 ; 361711 ; 361752 ; 361796 ; 174 152 ; 174252 ; 257720 ; 257675 ;
Abstract

A semiconductor device comprises a printed circuit board with circuit pattern formed thereon, and a semiconductor wafer having terminals installed on its peripheral portion. Semiconductor chips are mounted on one surface or both surfaces of the semiconductor wafer. A connector is installed on the printed circuit board for electrical connection with the terminals. When the terminals are connected to the circuit pattern, the semiconductor wafer is installed substantially vertically on the printed circuit board. Or a semiconductor wafer member is constituted by two semiconductor wafers, and a closed space is internally formed between the two wafers and heat pipes for heat radiation are inserted in the closed space.


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