The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 1995
Filed:
Jan. 13, 1993
Chao-Hui Lin, Taichung, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A surface mountable microwave IC package with broad bandwidth and low loss has been developed. The impedance mismatch due to the electrical discontinuity of the I/O pads and via holes in the structure is compensated. The compensation structure has two features. In one feature, ground planes are printed on both sides of a dielectric substrate to increase the distributed capacitance between the signal line and the ground, thereby obtaining a matched characteristic impedance. In the second feature, two grounding via holes are used to compensate for the mismatch of the charactersitic impedance due to the feedthrough via-slot connection of the signal line from the back-side to the front-side of the substrate.