The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 1995
Filed:
Dec. 15, 1993
Kiyoshi Ishibashi, Itami, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A pressure sensor element (50) is bonded to a die bonding pad (4). The pressure sensor element (50) is thereafter entirely covered with epoxy resin (11) and completely packaged. Following this, the epoxy resin (11) is locally removed at a portion above a diaphragm (5) of the pressure sensor element (50). As a result, the diaphragm (5) is exposed. In this method, the diaphragm (5) is uncovered without using a special metallic mold which prohibits the epoxy resin (11) from flowing into a space above the diaphragm (5). A gold wire (8) is also molded by the package sealing. Thus, a resulting package-molded pressure sensing semiconductor device is highly reliable under adverse environmental conditions and considerably cost-effective.