The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 1995

Filed:

Apr. 28, 1993
Applicant:
Inventors:

Yasushi Kouno, Shizuoka, JP;

Takeo Hayashi, Shizuoka, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05C / ; B05C / ;
U.S. Cl.
CPC ...
118 23 ; 118 29 ; 118 31 ; 118400 ; 118500 ; 118506 ;
Abstract

A gel-coating apparatus for seeds comprising: a nozzle portion for forming and cutting a gel coating film by opening and closing operation of a cutting plunger; a seed storing vessel moving upward and downward; an arm having a rotation shaft at the center thereof and a hollow needle at both ends thereof; a seed supply portion having pipes for communicating the needles with a negative pressure source and a positive pressure source by way of electromagnetic valves; a curing vessel provided below the nozzle portion; and a control section for synchronously operating the movement of the curing vessel, the nozzle portion, the seed storing vessel, the arm, and the seed supply portion. With the above apparatus, a method of gel-coating seeds according to the present invention comprising the steps of gel-coating seeds into a larger spherical form, immersing the seed into a curing agent for a predetermined period of time to cure the surface of the gel-coating layer and, subsequently, taking the gel-coated seed out of the curing agent, washing out the deposited curing agent with water and curing only the surface of the layer.


Find Patent Forward Citations

Loading…