The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 1995

Filed:

Jun. 11, 1993
Applicant:
Inventors:

Morris Anschel, Wappingers Falls, NY (US);

Anthony P Ingraham, Endicott, NY (US);

Charles R Lamb, Endwell, NY (US);

Michael D Lowell, Endicott, NY (US);

Voya R Markovich, Endwell, NY (US);

Wolfgang Mayr, Poughkeepsie, NY (US);

Richard G Murphy, Binghamton, NY (US);

Mark V Pierson, Binghamton, NY (US);

Tamar A Powers, Endicott, NY (US);

Timothy S Reny, Underhill Center, VT (US);

Scott D Reynolds, Endwell, NY (US);

Bahgat G Sammakia, Newark Valley, NY (US);

Wayne R Storr, Great Bend, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R / ; G01R / ;
U.S. Cl.
CPC ...
324754 ; 324760 ;
Abstract

A method of testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip test fixture system is provided. The chip test fixture system has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into electrically conductive contact with the conductor pads on the chip test fixture system. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing the chip is removed from the substrate.


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