Semiconductor device having stable breakdown voltage in wiring area

Abstract

A semiconductor device having stable breakdown voltage in wiring area. The semiconductor has a first conducting type semiconductor substrate with a plurality of second conducting type first semiconductor regions formed on one part of the surface of the first conducting type semiconductor substrate. A first conducting type high density diffused second semiconductor region is formed on one part of the surface within the second conducting type first semiconductor region. A gate electrode material extends across one part of the surface of the first conducting type semiconductor substrate, where one part of the surface of the first conducting type high density diffused second semiconductor region and the second conducting type first semiconductor region are not formed. An insulating film covers the gate electrode material and a metal source wiring is connected to the first conducting type high density diffused second semiconductor region and the second conducting type first semiconductor region. A metal gate wiring is connected to one part of the surface of the gate electrode material through an open section provided in the insulating film, and second conducting type third semiconductor regions are formed as a plurality of partitions on the surface of the first conducting type semiconductor substrate on the lower part of the metal gate wiring. In the semiconductor device, the second conducting type third semiconductor region is positioned to approach the limit reached by a depletion layer extending from the second conducting type third semiconductor region toward the first conducting type semiconductor substrate.