The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 1995
Filed:
Jun. 30, 1993
Applicant:
Inventor:
Edmund Burke, Dallas, TX (US);
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
H01l / ; H01l / ;
U.S. Cl.
CPC ...
437192 ; 437228 ;
Abstract
A method is provided for forming a local interconnect (24) at a face of semiconductor workpiece (10). A layer of conductive material (24) is formed across the workpiece face, followed by the formation of a layer (28) of photoresist adjacent the layer of conductive material (24). The layer of photoresist (28) is patterned to define selected areas of the layer of conductive material (24) to be removed. A dry etch is performed, using a plasma established in a gaseous mixture of carbon tetrachloride, carbon tetrafluoride, and helium, to remove the selected areas of the conductive material and conductive filaments (26) formed at the face of workpiece (10).