The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 1995
Filed:
May. 17, 1994
Patrick H Martin, Danville, CA (US);
Peter K Kim, Danville, CA (US);
Stephen E Bales, Midland, MI (US);
Ritchie A Wessling, Midland, MI (US);
The Dow Chemical Company, Midland, MI (US);
Abstract
This invention relates to a low heat release, low density, fiber-reinforced composite comprising a matrix comprising a thermoplastic polymer selected from the group consisting of polyarylsulfone, polyethersulfone, polyetheretherketone, polyetherketoneketone, a copolycarbonate of 4,4'-thiodiphenol and at least one member of the group consisting of bisphenol A, 9,9-bis(4-hydroxyphenyl)fluorene, and 1,1-bis(4-hydroxyphenyl)-1-phenyl ethane, a copolycarbonate of bisphenol A and 9,9-bis(4-hydroxyphenyl)fluorene, 1,1-bis(4-hydroxyphenyl)-1-phenyl ethane polycarbonate, bisphenol A polycarbonate, and polyetherimide, and from about 10 to about 70 percent by weight of the composite of randomly oriented reinforcing fibers, less than 0.5 inch in length, distributed throughout the matrix. The matrix has a void volume of from about 20 to about 90 percent by volume. The composite has a thermoplastic skin layer on each of the major surfaces thereof. A process for making the composite is also disclosed.