The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 1995

Filed:

Dec. 01, 1993
Applicant:
Inventor:

Kuniaki Tsurushima, Atsugi, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ; C25D / ;
U.S. Cl.
CPC ...
2042 / ; 204275 ;
Abstract

An injection plating apparatus for uniformly plating external leads of a semiconductor product having a lead-missing portion. The injection plating apparatus comprises cavity boxes for compressing a semiconductor product. Masks, attached to the cavity boxes, serve as masks in plating injection for covering at least a lead-missing portion of the semiconductor product. The injection plating apparatus further comprises means for plating the external leads of the semiconductor product.


Find Patent Forward Citations

Tsurushima, Kuniaki. (1995). Injection plating apparatus (U.S. Patent No. 5417830). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5417830

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…