The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 1995
Filed:
Jun. 23, 1994
Shuji Takeshita, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A process for manufacturing a thin film circuit board includes forming an insulator layer having a relatively high etching rate in a desired thickness on an insulator layer having a relatively low etching rate and a relatively high dielectric constant, arranging a conductor layer on the insulator layer having a relatively high etching rate, selectively removing the insulator having a relatively high etching rate by etching but excluding a portion located beneath the conductor layer, forming an insulator portion that contains the insulator layer having a relatively high etching rate and supports the conductor layer in the undercut state, forming an insulator layer having a relatively low dielectric constant so as to surround the entire conductor layer, and forming an insulator layer having a relatively high dielectric constant on top of the insulator layer having a relatively low dielectric constant so as to surround the entire insulator layer having a relatively low dielectric constant.