The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 1995

Filed:

Dec. 24, 1992
Applicant:
Inventors:

Robert S Mroczkowski, Lititz, PA (US);

Richard E Rothenberger, Harrisburg, PA (US);

Assignee:

The Whitaker Corporation, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439101 ;
Abstract

Printed wiring boards having low signal-to-ground ratios. Printed wiring boards described herein comprise a first and second sides, and a plurality of signal plated-through-holes extending from the first side to the second side of the printed wiring board. There is also provided a plurality of ground plated-through-holes extending from the first side to the second side of the printed wiring board, and a ground plane plated on a first side and in electrical communication with selected ones of the plurality of ground plated-through-holes and defining a signal-to-ground ratio for the printed wiring boards. Printed wiring boards described herein with plating patterns in accordance with the invention are versatile and ensure high electrical integrity by modifying the signal-to-ground ratio of the printed wiring boards and enabling higher density of contact pads.


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