The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 1995
Filed:
Sep. 27, 1993
Hiroshi Tateishi, Fujinomiya, JP;
Yuji Natori, Yokohama, JP;
Ricoh Company, Ltd., Tokyo, JP;
Abstract
A thermal stencil plate making method, by which a perforation image is formed on a thermal stencil original sheet comprising a thermoplastic resin film and a porous support laminated on each other or a thermal stencil original sheet composed substantially only of a thermoplastic resin film by applying thermal energy to the thermal stencil original sheet by means of a thermal head, is characterized in that a distance between heating elements in the thermal head: d (.mu.m) and a thickness of a heating element protection layer: T (.mu.m) satisfy the following condition of Equation (1) and that a secondary scan direction heating element spacing between heating elements in the thermal head: D (.mu.m) and the thickness of the heating element protection layer: T (.mu.m) satisfy the following condition of Equation (2):