The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 1995
Filed:
Jul. 08, 1994
Peng-Cheng Lin, Cupertino, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
The invention provides a method and apparatus for picking a separated semiconductor die 128 from a wafer and placing it on a die attach pad 144 for bonding thereto. In a preferred embodiment, the apparatus comprises a die collet having a body 124 with a proximal end 123 and a distal end 125; at least one pair of spaced-apart walls 136 extending distally from the distal end of the body and having opposing faces 181 defining an aperture 126, the faces of the walls being sloped such that a distal portion of the aperture is wider than the die and a proximal portion of the aperture is narrower than the die; a recess 152 on the faces of the walls extending substantially the length of the die, the recess having a distally-facing surface 154 for contacting at least a portion of the top side 138 of the die; and means for holding the die in the aperture, usually including a vacuum port 128. The method comprises providing a collet like the aforementioned; positioning the aperture 126 over a die 120; exerting a vacuum pressure through the vacuum port 128 to retain the die in the aperture such that a portion of the top side contacts the distally-facing surface 154 of the recess 152; positioning the die over the pad 144 such that the bottom side of the die is parallel to the pad; and discontinuing the vacuum pressure to release the die from the aperture.