The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 1995
Filed:
Aug. 17, 1994
Applicant:
Inventors:
Mark E Stout, Plymouth, MN (US);
Clinton S Vilks, Brooklyn Park, MN (US);
Assignee:
Honeywell Inc., Minneapolis, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361704 ; 165 803 ; 211 41 ; 361719 ; 361796 ;
Abstract
In the present invention, a heat transferring arrangement is disclosed for a printed wiring board assembly. A heat conductive panel is provided to be in close proximity to a component side of a printed wiring board. The heat conductive panel further includes flange members, so that the flange members may be forced against a heat conducting surface of a chassis and provide a thermally conductive contact therewith. With this arrangement, heat transfer by radiation from the circuit components to the heat conductive panel is enhanced and thereby permits heat transfer by conduction from the heat conductive panel to the chassis.