The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 1995
Filed:
Dec. 21, 1993
Applicant:
Inventors:
Han-Sheng Lee, Bloomfield Hill, MI (US);
Steven E Staller, Kokomo, IN (US);
Dan W Chilcott, Sharpsville, IN (US);
Assignee:
Delco Electronics Corporation, Kokomo, IN (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437 86 ; 437901 ; 437974 ; 148 332 ; 148D / ;
Abstract
A process for silicon wafer-to-wafer bonding at temperatures lower than 500.degree. C. has been developed. It consists of (1) treating the cleaned surfaces to make them smooth and hydrophilic, (2) initiating the bond by making intimate contact between wafers and (3) enhancing the bond strength at elevated temperatures. This bonding process can be applied to sensor packaging.