The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 1995

Filed:

Feb. 19, 1993
Applicant:
Inventor:

Keith G Newman, Sunnyvale, CA (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437209 ; 437211 ; 437214 ; 437215 ; 437217 ; 437219 ; 437220 ;
Abstract

An apparatus and method for controlling unwanted spread of adhesive used to attach a semiconductor integrated circuit die to an integrated circuit package assembly. A barrier prevents the adhesive from spreading onto bond finger connections of the integrated circuit package. The barrier may be a solder mask ring outside of and encircling the perimeter of the die attachment area of the package assembly. The barrier is located between the die attachment area and the adjacent bond fingers of the package.


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