The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 1995

Filed:

Feb. 14, 1992
Applicant:
Inventor:

Lucien D Laude, 59330 Hautmont, FR;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427555 ; 427198 ; 427201 ; 427203 ; 427205 ; 427264 ; 427265 ; 427270 ; 427275 ; 427276 ; 427284 ; 427289 ; 427307 ; 427357 ; 427367 ; 427380 ; 4273831 ; 4274431 ; 427553 ; 427554 ; 427556 ;
Abstract

The method for metallizing the surface of dielectric materials according to the invention comprises a first step wherein a metal powder, the size of the grains of which is comprised between 10 and 5000 nm, is deposited and then incorporated into the surface of the dielectric material. In a second step of the method, the dielectric material which is so impregnated with metal, is immersed into an autocatalytic bath to coat the impregnated zones of the material with a layer of the metal contained in the bath in a thickness which is proportional to the immersion time. This method enables to metallize materials such as oxides, polymers and composites containing these oxides and/or these polymers. The characteristics of the metal deposits are controlled, on the one hand, by the type of metal, and the size and the geometry of the metal powder grains and, on the other hand, by the type and the structure of the dielectric materials coated with these deposits.


Find Patent Forward Citations

Loading…