The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 1995
Filed:
Jul. 22, 1993
Katsumi Kohama, Saitama, JP;
Hiromi Tanaka, Tokyo, JP;
Ryoichi Yugami, Saitama, JP;
Tomohisa Abe, Saitama, JP;
Daisuke Atobe, Osaka, JP;
Hidemitsu Takizawa, Osaka, JP;
Kenichi Ueda, Osaka, JP;
Yuji Inagaki, Osaka, JP;
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Nippon Shokubai Kagaku Kogyo Co., Ltd., Osaka, JP;
Abstract
In a method for molding a sheet which includes thermosetting resin materials reinforced with glass fiber or carbon fiber, the sheet includes a covering film always existing in a side which is not in contact with a mold face and, when the sheet and covering film are shaped along a mold face and the sheet is thermally cured, apparatus for dealing with an accidental breakage of the covering film is arranged on the side of the sheet which is covered by said covering film.