The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 1995
Filed:
Feb. 15, 1994
Applicant:
Inventors:
Tien-Heng Chiu, Spotswood, NJ (US);
Won-Tien Tsang, Holmdel, NJ (US);
Assignee:
AT&T Corp., Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
156650 ; 156652 ; 156646 ; 156662 ; 437228 ;
Abstract
A device fabrication method includes an etching step for compound III/V semiconductor materials such as gallium arsenide or indium phosphide. The step is carried out in the chamber of a growth reactor under conditions that are compatible with a subsequent growth step performed in the same reactor. Specifically, etching is performed in a so-called pulsed mode wherein each etching interval is followed by an interval in which etching is interrupted. Moreover, a Group III species such as indium is introduced into the chamber during each etching interval to enhance the smoothness of the etched surface.