The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 1995

Filed:

Oct. 27, 1992
Applicant:
Inventors:

Rudolf Drabek, Vienna, AT;

Werner Uggowitzer, Ferlach, AT;

Assignee:

U.S. Philips Corporation, New York, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174262 ; 174259 ; 174261 ; 361778 ;
Abstract

A two-layer or multilayer printed circuit board (1) comprises a support plate (2) carrying a first conductor pattern (3) and a second conductor pattern (21) which is connected to the support plate (2) via an adhesive layer (13) consisting of adhesive material, a solder-stop layer (30) being applied to the second conductor pattern. A hole (14, 15) is formed in the adhesive layer (13), via which hole a solder section (4, 5) of the first conductor pattern (3) can be electrically connected to a solder section (22, 23) of the second conductor pattern (21) via a soldered joint (37, 38), a further hole (31, 32) being formed in the solder-stop layer (30), which hole communicates with the hole (14, 15) in the adhesive layer (13), the cross-sectional area of the further hole being divisible in two areas of equal shape and equal surface content, one of the areas being coincident with the cross-sectional area of the hole (14, 15) in the adhesive layer (13) and the other area being situated completely inside a closed area of the solder section (22, 23) of the second conductor pattern (21).


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