The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 1995
Filed:
Jul. 16, 1993
Yasuhiko Matsumoto, Hamamatsu, JP;
Hattori Atsuo, Hamamatsu, JP;
Yamaha Corporation, Hamamatsu, JP;
Abstract
A multi-layered wiring structure, having a first level metal wiring layer and a second level metal wiring layer, is formed on a semiconductor substrate. A first level interlayer insulating film which has an undulation caused by the first level metal wiring layer, a second level metal wiring layer which also has an uneven surface, and a second level interlayer insulating layer are consecutively deposited on the semiconductor substrate. A reflection preventing film (TiN) of 80 nm or more thickness is deposited over the second level interlayer insulating film, and a resist layer is coated on the reflection preventing film. Then, an ultra-violet ray is irradiated through a patterning mask to make an opening corresponding to a contact hole. The reflection preventing film constrains a multi-reflection of the ultra-violet ray. Thus, an accuracy of the patterning of the contact hole is improved.