The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 1995
Filed:
Jul. 14, 1993
Toshio Taka, Kawasaki, JP;
Takeshi Onoda, Kawasaki, JP;
Hisashi Hatano, Kawasaki, JP;
Tomoaki Kobayashi, Kawasaki, JP;
Terumitu Kotani, Kawasaki, JP;
Showa Denko K.K., Tokyo, JP;
Abstract
A method and apparatus for molding an inflation film even from a thermoplastic resin having a small melt tension, in which a melt resin bubble extruded from an extruder is molded, while controlling a resin temperature of the bubble to a certain temperature range by an air ring provided with a plurality of annular slits for blowing cooling air in a take-up direction of the melt resin bubble and provided at a position at which the melt resin bubble is remarkably expanded, after (a) cooling air is blown to a melt resin bubble from a first air ring provided at the proximity of a die outlet to cool said melt resin bubble; and, then, the bubble is either (i) brought into contact, on the inner surface thereof, with the surface of a stabilizer provided on a die surface, or (ii) is supported in a non-contact state through an air layer, while being taken up.