The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 1995

Filed:

Nov. 18, 1993
Applicant:
Inventors:

Jeffery S Kunkler, Fond du Lac, WI (US);

Gene D Goetz, Shorewood, WI (US);

Assignee:

Johnson Service Company, Milwaukee, WI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ;
U.S. Cl.
CPC ...
361809 ; 174 521 ; 220-402 ;
Abstract

A wall-mounted enclosure for mounting electrical and electronic equipment and the like, in modular form. The enclosure body takes the form of a mounting assembly, including mounting modules, with each module including a backbone element and a cover element. The backbone element has a horizontally extending backplane bordered by two upstanding side portions, with an interassembly connecting mechanism for joining one backbone element to an adjacent backbone element. The backplane includes a flat mounting surface, with a pattern of preformed pilot holes, and two recessed wiring channels. Interconnection is provided by interlocks and screw anchor points. The cover element includes a horizontally extending cover plate with coverwalls and a cover assembly connecting mechanism for joining one cover element to another cover element. Adjacent cover elements are joined by mutual engagement of a mating tab and slot, and by screw anchor points. The cover element is removably mounted on the backbone element to rotate between an open position and a closed position. Modules are assembled into the mounting assembly by coplanar abutment of modules with mutual engagement of the backbone assembly connecting mechanism and the cover assembly connecting mechanism. Two identical endcap elements are joined to the outermost modules of the mounting assembly to enclose an interior enclosure space.


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