The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 1995

Filed:

Nov. 20, 1992
Applicant:
Inventors:

Fariborz Agahdel, San Jose, CA (US);

Brad Griswold, San Jose, CA (US);

Syed Husain, Milpitas, CA (US);

Robert Moti, San Jose, CA (US);

William C Robinette, Jr, Los Altos, CA (US);

Chung W Ho, Monte Sereno, CA (US);

Assignee:

Micromodule Systems, Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R / ;
U.S. Cl.
CPC ...
324758 ; 3241581 ;
Abstract

An integrated circuit carrier comprising: a substrate defining an opening and an outer perimeter; a multiplicity of I/O pads disposed about the perimeter; an interconnect circuit which includes a composite of a multiplicity of individual electrical conductors which are formed in a polymer dielectric; wherein the interconnect circuit overlays a top surface of the substrate and extends across the opening so as to span the opening; a multiplicity of die contact pads connected to the conductors are disposed about the flexible polymer dielectric with particles deposited on the die contact pads; a polymer dielectric fence upstanding from the membrane and sized to receive an integrated circuit; a top cap that rests upon the integrated circuit when the integrated circuit is received within the fence; a bottom cap that rests against a bottom surface of the substrate; and a fastener for securing the top cap to the bottom cap with the integrated circuit disposed therebetween.


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