The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 1995
Filed:
Mar. 18, 1993
Young K Jun, Seoul, KR;
Chang J Lee, Seoul, KR;
Goldstar Electron Co., Ltd., , KR;
Abstract
A method of making a semiconductor device capable of simplifying the overall manufacturing processes and carrying out the reliable interconnections between wires. The method includes forming a first insulator over a semiconductor substrate, forming a first conductor over the first insulator and then patterning the first conductor to form a plurality of first wires, forming a second insulator over the entire exposed surface and then removing a portion of the second insulator disposed over the surface of a selector first wire to form a contact hole, forming a second conductor over the entire exposed surface and then patterning the second conductor to form an interconnection wire over the contact hole, forming a third insulator having uniform thickness and a fourth insulator having the smoothing surface in this order, etching back the third insulator and the fourth insulator, until the surface of the interconnection wire is exposed, and forming a third conductor having an uniform thickness over the entire exposed surface and the then patterning the third conductor to form a second wire to be connected to the selected first wire through the interconnection wire.