The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 1995
Filed:
Jun. 09, 1993
Yoshihisa Imori, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A semiconductor product plating apparatus includes housings having a first mask portion for masking both the surfaces of a resin package of a semiconductor device and a second mask portion for masking the peripheral portion of a lead frame, when clamping a semiconductor product from both surface sides of the lead frame, and hollow portions surrounding outer leads between the semiconductor device and the peripheral portion of the lead frame. Electrolytic solution supply slits and electrolytic solution drainage slits are formed in the housings so as to communicate with the hollow portions. The apparatus also includes electrodes formed on portions of the inner wall surfaces of the hollow portions. The first mask portion has a tapered side surface which widens toward the end. The electrolytic solution supply slits have opening portions formed in a direction to cross the proximal end portions of the outer leads and communicating with the side surface of the first mask portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile