The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 1995
Filed:
Jun. 28, 1993
Mamoru Kimoto, Osaka, JP;
Shinya Inoue, Osaka, JP;
Masao Takee, Osaka, JP;
Fusago Mizutaki, Osaka, JP;
Koji Nishio, Osaka, JP;
Motoo Tadokoro, Osaka, JP;
yoshito Chikano, Osaka, JP;
Yoshinori Matsuura, Osaka, JP;
Nobuhiro Furukawa, Osaka, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A hydrogen-absorbing alloy electrode comprises a conductive substrate, a layer of hydrogen-absorbing alloy granules disposed on the conductive substrate and a binder for binding the granules together and to the conductive substrate. A part of the granules is exposed on a surface of the layer on the electrode. The layer may have a predetermined thickness and the granules may include large size granules having a maximum diameter larger than half the thickness of the layer but smaller than the thickness of the layer. The granules may include first granules having a first average diameter and second granules having a second average diameter smaller than the first average diameter; the first granules may be 5 wt % or more but less than 20 wt % of the total weight of the granules.