The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 1995
Filed:
Jan. 22, 1993
Kiyoshi Ishibashi, Itami, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor pressure sensor has a semiconductor pressure sensing element sensitive to pressure and a hollow package accommodating the semiconductor pressure sensing element. The semiconductor pressure sensor also has a first lead frame portion having a displaced die pad to which the semiconductor pressure sensor is die bonded and a plurality of suspension leads through which the die pad is suspended at its opposing sides. The semiconductor pressure sensor also has a second lead frame portion having a plurality of suspension leads which provide electrical connections between the semiconductor pressure sensing element and external devices. The package includes a resin base accommodating the semiconductor pressure sensing element fixed to the die pad and a resin cap bonded to the resin base with the first and second lead frame portions sandwiched therebetween with the die pad suspended in the resin base and the plurality of leads extending outwardly from the package.