The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 1995
Filed:
Sep. 22, 1993
Kazutoshi Oku, Hyogo, JP;
Masahiro Hirosue, Hyogo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A bonding pad comprises a central film and a peripheral film. The peripheral film is formed around the central film, including a film formed at the same time as the central film, and being continuous with the central film. The level of the central film is made equal to or higher than the level of a protective film on the peripheral film by central film raising means. Therefore, even if the wire moves in a lateral direction when the tip of a wire is pressed against the central film, the tip of the wire does not collide with the protective film. Accordingly, it is possible to avoid the case where cracks are generated in the surface protecting film during wire bonding because of a lateral movement of the wire.